Details
- Title: 2024 57th IEEE/ACM International Symposium on Microarchitecture (MICRO 2024)
- Date/Location: Held 2-6 November 2024, Austin, Texas, USA.
- IEEE #: CFP24071-POD
- ISBN: 9798350350586
- Pages: 1,692 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 57th IEEE/ACM International Symposium on Microarchitecture (MICRO 2024)
- Date/Location: Held 2-6 November 2024, Austin, Texas, USA.
- IEEE #: CFP24071-POD
- ISBN: 9798350350586
- Pages: 1,692 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )