Details
- Title: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV 2023)
- Date/Location: Held 25-30 June 2023, Okinawa, Japan.
- IEEE #: CFP23430-POD
- ISBN: 9798350322224
- Pages: 596 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV 2023)
- Date/Location: Held 25-30 June 2023, Okinawa, Japan.
- IEEE #: CFP23430-POD
- ISBN: 9798350322224
- Pages: 596 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )