Details
- Title: 2023 International Conference on Electronics Packaging (ICEP 2023)
- Date/Location: Held 19-22 April 2023, Kumamoto, Japan.
- IEEE #: CFP2389U-POD
- ISBN: 9798350336726
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 International Conference on Electronics Packaging (ICEP 2023)
- Date/Location: Held 19-22 April 2023, Kumamoto, Japan.
- IEEE #: CFP2389U-POD
- ISBN: 9798350336726
- Pages: 270 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )