Details
- Title: 2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2023)
- Date/Location: Held 19-21 April 2023, Tokyo, Japan.
- IEEE #: CFP23COL-POD
- ISBN: 9798350332025
- Pages: 55 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS 2023)
- Date/Location: Held 19-21 April 2023, Tokyo, Japan.
- IEEE #: CFP23COL-POD
- ISBN: 9798350332025
- Pages: 55 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )