Details
- Title: 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2021)
- Date/Location: Held 4 November 2021, Virtual Workshop.
- IEEE #: CFP21SLP-POD
- ISBN: 9781665400848
- Pages: 61 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2021)
- Date/Location: Held 4 November 2021, Virtual Workshop.
- IEEE #: CFP21SLP-POD
- ISBN: 9781665400848
- Pages: 61 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )