Details
- Title: 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2021)
- Date/Location: Held 13-15 December 2021, Urbana, Illinois, USA.
- IEEE #: CFP21EDP-POD
- ISBN: 9781665466141
- Pages: 78 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2021)
- Date/Location: Held 13-15 December 2021, Urbana, Illinois, USA.
- IEEE #: CFP21EDP-POD
- ISBN: 9781665466141
- Pages: 78 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2022 )