Details
- Title: 2021 IEEE/ACM International Workshop on Hierarchical Parallelism for Exascale Computing (HiPar 2021)
- Date/Location: Held 14 November 2021, St. Louis, Missouri, USA.
- IEEE #: CFP21Z81-POD
- ISBN: 9781665411332
- Pages: 41 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE/ACM International Workshop on Hierarchical Parallelism for Exascale Computing (HiPar 2021)
- Date/Location: Held 14 November 2021, St. Louis, Missouri, USA.
- IEEE #: CFP21Z81-POD
- ISBN: 9781665411332
- Pages: 41 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2022 )