Details
- Title: 2021 IEEE Symposium on High-Performance Interconnects (HOTI 2021)
- Date/Location: Held 18-20 August 2021, Virtual Conference.
- IEEE #: CFP21HIS-POD
- ISBN: 9781665432498
- Pages: 73 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2021 )
Description
Members/Attendees
Tab 4
- Title: 2021 IEEE Symposium on High-Performance Interconnects (HOTI 2021)
- Date/Location: Held 18-20 August 2021, Virtual Conference.
- IEEE #: CFP21HIS-POD
- ISBN: 9781665432498
- Pages: 73 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2021 )