Details
- Title: 2020 International Wafer Level Packaging Conference (IWLPC 2020)
- Date/Location: Held 13-30 October 2020, San Jose, California, USA.
- IEEE #: CFP20WAF-POD
- ISBN: 9781665402507
- Pages: 267 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2021 )
Description
Members/Attendees
Tab 4
- Title: 2020 International Wafer Level Packaging Conference (IWLPC 2020)
- Date/Location: Held 13-30 October 2020, San Jose, California, USA.
- IEEE #: CFP20WAF-POD
- ISBN: 9781665402507
- Pages: 267 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2021 )