Details
- Title: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC 2019)
- Date/Location: Held 4-6 November 2019, Macao.
- IEEE #: CFP19SSC-POD
- ISBN: 9781728151076
- Pages: 330 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC 2019)
- Date/Location: Held 4-6 November 2019, Macao.
- IEEE #: CFP19SSC-POD
- ISBN: 9781728151076
- Pages: 330 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2020 )