Details
- Title: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS 2019)
- Date/Location: Held 16-18 December 2019, Kaohsiung, Taiwan.
- IEEE #: CFP19EDP-POD
- ISBN: 9781728124339
- Pages: 134 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS 2019)
- Date/Location: Held 16-18 December 2019, Kaohsiung, Taiwan.
- IEEE #: CFP19EDP-POD
- ISBN: 9781728124339
- Pages: 134 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jun 2020 )