Details
- Title: 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2019)
- Date/Location: Held 20-23 October 2019, Richland, Washington, USA.
- IEEE #: CFP19CID-POD
- ISBN: 9781728131221
- Pages: 800 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2020 )
Description
Members/Attendees
Tab 4
- Title: 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2019)
- Date/Location: Held 20-23 October 2019, Richland, Washington, USA.
- IEEE #: CFP19CID-POD
- ISBN: 9781728131221
- Pages: 800 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2020 )