Details
- Title: 2019 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2019)
- Date/Location: Held 1-2 June 2019, Las Vegas, Nevada, USA.
- IEEE #: CFP19SLP-POD
- ISBN: 9781728128191
- Pages: 49 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2019 )
Description
Members/Attendees
Tab 4
- Title: 2019 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP 2019)
- Date/Location: Held 1-2 June 2019, Las Vegas, Nevada, USA.
- IEEE #: CFP19SLP-POD
- ISBN: 9781728128191
- Pages: 49 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2019 )