PROCESSING MATERIALS OF 3D INTERCONNECTS, DAMASCENE AND ELECTRONICS PACKAGING. (220TH ECS MEETING)

Item #:
035823
$64.00 - $80.00
Adding to cart… The item has been added

Details

  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging
  • Subtitle: 220th ECS Meeting
  • Date/Location: Held 9-14 October 2011, Boston, Massachusetts, USA.
  • Series: ECS Transactions Volume 41 No.43
  • Editor: Kondo, K. et al.
  • ISBN: 9781607683445
  • Pages: 136 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Sep 2017 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging
  • Subtitle: 220th ECS Meeting
  • Date/Location: Held 9-14 October 2011, Boston, Massachusetts, USA.
  • Series: ECS Transactions Volume 41 No.43
  • Editor: Kondo, K. et al.
  • ISBN: 9781607683445
  • Pages: 136 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Electrochemical Society (ECS)
  • POD Publisher: Curran Associates, Inc. ( Sep 2017 )