Details
- Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging
- Subtitle: 220th ECS Meeting
- Date/Location: Held 9-14 October 2011, Boston, Massachusetts, USA.
- Series: ECS Transactions Volume 41 No.43
- Editor: Kondo, K. et al.
- ISBN: 9781607683445
- Pages: 136 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )
Description
Members/Attendees
Tab 4
- Title: Processing Materials of 3D Interconnects, Damascene and Electronics Packaging
- Subtitle: 220th ECS Meeting
- Date/Location: Held 9-14 October 2011, Boston, Massachusetts, USA.
- Series: ECS Transactions Volume 41 No.43
- Editor: Kondo, K. et al.
- ISBN: 9781607683445
- Pages: 136 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )