Details
- Title: Processing, Materials, and Integration of Damascene and 3D Interconnects
- Subtitle: 218th ECS Meeting
- Date/Location: Held 10-15 October 2010, Las Vegas, Nevada, USA.
- Series: ECS Transactions Volume 33 No.12
- Editor: Flake, J. et al.
- ISBN: 9781607681816
- Pages: 164 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )
Description
Members/Attendees
Tab 4
- Title: Processing, Materials, and Integration of Damascene and 3D Interconnects
- Subtitle: 218th ECS Meeting
- Date/Location: Held 10-15 October 2010, Las Vegas, Nevada, USA.
- Series: ECS Transactions Volume 33 No.12
- Editor: Flake, J. et al.
- ISBN: 9781607681816
- Pages: 164 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Electrochemical Society (ECS)
- POD Publisher: Curran Associates, Inc. ( Sep 2017 )