THIRD INTERNATIONAL CONFERENCE ON ELECTRONIC INFORMATION ENGINEERING AND DATA PROCESSING (EIEDP 2024) (2 PARTS)

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075638

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Title: Third International Conference on Electronic Information Engineering and Data Processing (EIEDP 2024)
Date/Location: Held 15-17 March 2024, Kuala Lumpur, Malaysia.
Series: Proceedings of SPIE Volume 13184
Editor: Jabbar, M. A.
ISBN: 9781510680531
Pages: 1,874 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: SPIE - International Society for Optics and Photonics
POD Publisher: Curran Associates, Inc. ( Sep 2024 )

Title: Third International Conference on Electronic Information Engineering and Data Processing (EIEDP 2024)
Date/Location: Held 15-17 March 2024, Kuala Lumpur, Malaysia.
Series: Proceedings of SPIE Volume 13184
Editor: Jabbar, M. A.
ISBN: 9781510680531
Pages: 1,874 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: SPIE - International Society for Optics and Photonics
POD Publisher: Curran Associates, Inc. ( Sep 2024 )