INTERNATIONAL CONFERENCE ON MECHATRONIC ENGINEERING AND ARTIFICIAL INTELLIGENCE (MEAI 2023) (2 PARTS)

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073587
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Details

  • Title: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023)
  • Date/Location: Held 15-17 December 2023, Shenyang, China.
  • Series: Proceedings of SPIE Volume 13071
  • Editor: Ye, Xuexia
  • ISBN: 9781510674608
  • Pages: 1,052 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( Apr 2024 )

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  • Title: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023)
  • Date/Location: Held 15-17 December 2023, Shenyang, China.
  • Series: Proceedings of SPIE Volume 13071
  • Editor: Ye, Xuexia
  • ISBN: 9781510674608
  • Pages: 1,052 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( Apr 2024 )