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RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES IX
- Item #:
- 043848
- UPC:
Details
-
Title:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
-
Subtitle:
At SPIE MOEMS-MEMS
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Date/Location:
Held 25-26 January 2010, San Francisco, California, USA.
-
Series:
Proceedings of SPIE Volume 7592
-
Editor:
Kullberg, Richard C.
-
ISBN:
9780819479884
-
Pages:
344 (1 Vol) (approx)
-
Format:
Softcover
-
Publisher:
SPIE - International Society for Optics and Photonics
-
POD Publisher:
Curran Associates, Inc. ( Feb 2010 )
-
Title:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
-
Subtitle:
At SPIE MOEMS-MEMS
-
Date/Location:
Held 25-26 January 2010, San Francisco, California, USA.
-
Series:
Proceedings of SPIE Volume 7592
-
Editor:
Kullberg, Richard C.
-
ISBN:
9780819479884
-
Pages:
344 (1 Vol) (approx)
-
Format:
Softcover
-
Publisher:
SPIE - International Society for Optics and Photonics
-
POD Publisher:
Curran Associates, Inc. ( Feb 2010 )