RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES VIII

Item #:

043462

Our Price: $70.00

Details

Title: Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Subtitle: At SPIE MOEMS-MEMS: Micro- and Nanofabrication
Date/Location: Held 28-29 January 2009, San Jose, California, USA.
Series: Proceedings of SPIE Volume 7206
Editor: Kullberg, Richard C.
ISBN: 9780819474520
Pages: 180 (1 Vol) (approx)
Format: Softcover
Publisher: SPIE - International Society for Optics and Photonics
POD Publisher: Curran Associates, Inc. ( Feb 2009 )

Title: Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Subtitle: At SPIE MOEMS-MEMS: Micro- and Nanofabrication
Date/Location: Held 28-29 January 2009, San Jose, California, USA.
Series: Proceedings of SPIE Volume 7206
Editor: Kullberg, Richard C.
ISBN: 9780819474520
Pages: 180 (1 Vol) (approx)
Format: Softcover
Publisher: SPIE - International Society for Optics and Photonics
POD Publisher: Curran Associates, Inc. ( Feb 2009 )