MICROELECTRONICS: DESIGN, TECHNOLOGY, AND PACKAGING III

MICROELECTRONICS: DESIGN, TECHNOLOGY, AND PACKAGING III

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043056
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  • Title: Microelectronics: Design, Technology, and Packaging III
  • Subtitle: At SPIE Microelectronics, MEMS, and Nanotechnology
  • Date/Location: Held 5-7 December 2007, Canberra, ACT, Australia.
  • Series: Proceedings of SPIE Volume 6798
  • Editor: Hariz, Alex J.
  • ISBN: 9780819469694
  • Pages: 382 (1 Vol) (approx)
  • Format: Softcover
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( Dec 2007 )

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  • Title: Microelectronics: Design, Technology, and Packaging III
  • Subtitle: At SPIE Microelectronics, MEMS, and Nanotechnology
  • Date/Location: Held 5-7 December 2007, Canberra, ACT, Australia.
  • Series: Proceedings of SPIE Volume 6798
  • Editor: Hariz, Alex J.
  • ISBN: 9780819469694
  • Pages: 382 (1 Vol) (approx)
  • Format: Softcover
  • Publisher: SPIE - International Society for Optics and Photonics
  • POD Publisher: Curran Associates, Inc. ( Dec 2007 )