Details
- Title: 2024 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2024)
- Date/Location: Held 6-9 October 2024, Auburn, Alabama, USA.
- IEEE #: CFP24CID-POD
- ISBN: 9798350366686
- Pages: 352 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2024)
- Date/Location: Held 6-9 October 2024, Auburn, Alabama, USA.
- IEEE #: CFP24CID-POD
- ISBN: 9798350366686
- Pages: 352 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )