Details
- Title: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2024)
- Date/Location: Held 30 October - 1 November 2024, Nara, Japan.
- IEEE #: CFP2418S-POD
- ISBN: 9798331519926
- Pages: 68 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2024)
- Date/Location: Held 30 October - 1 November 2024, Nara, Japan.
- IEEE #: CFP2418S-POD
- ISBN: 9798331519926
- Pages: 68 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )