PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION. 2024. (INTERPACK 2024)

PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION. 2024. (INTERPACK 2024)

Item #:
077617
Our Price: $220.00
Adding to cart… The item has been added

Details

  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2024
  • Date/Location: Held 8-10 October 2024, San Jose, California, USA.
  • ISBN: 9780791888469
  • Pages: 620 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jan 2025 )

Description

 

Members/Attendees

 

Tab 4

 
  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2024
  • Date/Location: Held 8-10 October 2024, San Jose, California, USA.
  • ISBN: 9780791888469
  • Pages: 620 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jan 2025 )