Details
- Title: 2024 IEEE International Symposium on Emerging Metaverse (ISEMV 2024)
- Date/Location: Held 21 October 2024, Bellevue, Washington, USA.
- IEEE #: CFP24VV9-POD
- ISBN: 9798350356069
- Pages: 56 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE International Symposium on Emerging Metaverse (ISEMV 2024)
- Date/Location: Held 21 October 2024, Bellevue, Washington, USA.
- IEEE #: CFP24VV9-POD
- ISBN: 9798350356069
- Pages: 56 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2025 )