Details
- Title: 2024 IEEE International Conference on Metaverse Computing, Networking, and Applications (MetaCom 2024)
- Date/Location: Held 12-14 August 2024, Hong Kong, China.
- IEEE #: CFP24DK5-POD
- ISBN: 9798331516000
- Pages: 373 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE International Conference on Metaverse Computing, Networking, and Applications (MetaCom 2024)
- Date/Location: Held 12-14 August 2024, Hong Kong, China.
- IEEE #: CFP24DK5-POD
- ISBN: 9798331516000
- Pages: 373 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )