THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 23RD 2024. (ITHERM 2024) (3 VOLS)

THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 23RD 2024. (ITHERM 2024) (3 VOLS)

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076914
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Details

  • Title: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2024)
  • Date/Location: Held 28-31 May 2024, Aurora, Colorado, USA.
  • IEEE #: CFP24ITH-POD
  • ISBN: 9798350364347
  • Pages: 1,725 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2024 )

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  • Title: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2024)
  • Date/Location: Held 28-31 May 2024, Aurora, Colorado, USA.
  • IEEE #: CFP24ITH-POD
  • ISBN: 9798350364347
  • Pages: 1,725 (3 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Nov 2024 )