Details
- Title: 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI 2024)
- Date/Location: Held 5-9 August 2024, Phoenix, Arizona, USA.
- IEEE #: CFP24EMC-POD
- ISBN: 9798350360400
- Pages: 642 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI 2024)
- Date/Location: Held 5-9 August 2024, Phoenix, Arizona, USA.
- IEEE #: CFP24EMC-POD
- ISBN: 9798350360400
- Pages: 642 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )