Details
- Title: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2024)
- Date/Location: Held 15-18 July 2024, Singapore.
- IEEE #: CFP24777-POD
- ISBN: 9798350360615
- Pages: 589 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2024)
- Date/Location: Held 15-18 July 2024, Singapore.
- IEEE #: CFP24777-POD
- ISBN: 9798350360615
- Pages: 589 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )