Details
- Title: 2024 25th International Conference on Electronic Packaging Technology (ICEPT 2024)
- Date/Location: Held 7-9 August 2024, Tianjin, China.
- IEEE #: CFP24553-POD
- ISBN: 9798350353815
- Pages: 1,903 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 25th International Conference on Electronic Packaging Technology (ICEPT 2024)
- Date/Location: Held 7-9 August 2024, Tianjin, China.
- IEEE #: CFP24553-POD
- ISBN: 9798350353815
- Pages: 1,903 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2024 )