Details
- Title: 2024 IEEE Hot Chips 36 Symposium (HCS 2024)
- Date/Location: Held 25-27 August 2024, Stanford, California, USA.
- IEEE #: CFP24HCS-POD
- ISBN: 9798350388510
- Pages: 427 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE Hot Chips 36 Symposium (HCS 2024)
- Date/Location: Held 25-27 August 2024, Stanford, California, USA.
- IEEE #: CFP24HCS-POD
- ISBN: 9798350388510
- Pages: 427 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2025 )