Details
- Title: 2024 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPS 2024)
- Date/Location: Held 15-18 July 2024, Shanghai, China.
- IEEE #: CFP24S63-POD
- ISBN: 9798350362961
- Pages: 103 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE International Conference on Decentralized Applications and Infrastructures (DAPPS 2024)
- Date/Location: Held 15-18 July 2024, Shanghai, China.
- IEEE #: CFP24S63-POD
- ISBN: 9798350362961
- Pages: 103 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2024 )