Details
- Title: 2024 IEEE 10th International Conference on Edge Computing and Scalable Cloud (EdgeCom 2024)
- Date/Location: Held 28-30 June 2024, Shanghai, China.
- IEEE #: CFP24VO7-POD
- ISBN: 9798350377149
- Pages: 118 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE 10th International Conference on Edge Computing and Scalable Cloud (EdgeCom 2024)
- Date/Location: Held 28-30 June 2024, Shanghai, China.
- IEEE #: CFP24VO7-POD
- ISBN: 9798350377149
- Pages: 118 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2024 )