Details
- Title: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2024)
- Date/Location: Held 2-5 June 2024, Dresden, Germany.
- IEEE #: CFP24DTI-POD
- ISBN: 9798350378276
- Pages: 152 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2024)
- Date/Location: Held 2-5 June 2024, Dresden, Germany.
- IEEE #: CFP24DTI-POD
- ISBN: 9798350378276
- Pages: 152 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2024 )