Details
- Title: 2024 47th International Conference on Telecommunications and Signal Processing (TSP 2024)
- Date/Location: Held 10-12 July 2024, Prague, Czech Republic.
- IEEE #: CFP2488P-POD
- ISBN: 9798350365603
- Pages: 352 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 47th International Conference on Telecommunications and Signal Processing (TSP 2024)
- Date/Location: Held 10-12 July 2024, Prague, Czech Republic.
- IEEE #: CFP2488P-POD
- ISBN: 9798350365603
- Pages: 352 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2024 )