Details
- Title: 2024 IEEE/ACM International Conference on Technical Debt (TechDebt 2024)
- Date/Location: Held 14-15 April 2024, Lisbon, Portugal.
- IEEE #: CFP24P50-POD
- ISBN: 9798350363845
- Pages: 47 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 IEEE/ACM International Conference on Technical Debt (TechDebt 2024)
- Date/Location: Held 14-15 April 2024, Lisbon, Portugal.
- IEEE #: CFP24P50-POD
- ISBN: 9798350363845
- Pages: 47 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2024 )