Details
- Title: 60th Annual Microelectronics and Packaging Conference and Exhibition (NordPac 2024)
- Date/Location: Held 11-13 June 2024, Tampere, Finland.
- ISBN: 9781713899013
- Pages: 82 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: International Microelectronics and Packaging Society, Nordic (IMAPS-Nordic)
- POD Publisher: Curran Associates, Inc. ( Jul 2024 )
Description
Members/Attendees
Tab 4
- Title: 60th Annual Microelectronics and Packaging Conference and Exhibition (NordPac 2024)
- Date/Location: Held 11-13 June 2024, Tampere, Finland.
- ISBN: 9781713899013
- Pages: 82 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: International Microelectronics and Packaging Society, Nordic (IMAPS-Nordic)
- POD Publisher: Curran Associates, Inc. ( Jul 2024 )