Details
- Title: 2024 International Conference on Electronics Packaging (ICEP 2024)
- Date/Location: Held 17-20 April 2024, Toyama, Japan.
- IEEE #: CFP2489U-POD
- ISBN: 9798350385908
- Pages: 342 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 International Conference on Electronics Packaging (ICEP 2024)
- Date/Location: Held 17-20 April 2024, Toyama, Japan.
- IEEE #: CFP2489U-POD
- ISBN: 9798350385908
- Pages: 342 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2024 )