Details
- Title: 2023 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC 2023)
- Date/Location: Held 14-16 December 2023, Bengaluru, India.
- IEEE #: CFP23AK5-POD
- ISBN: 9798350384666
- Pages: 631 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC 2023)
- Date/Location: Held 14-16 December 2023, Bengaluru, India.
- IEEE #: CFP23AK5-POD
- ISBN: 9798350384666
- Pages: 631 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2024 )