Details
- Title: 2023 Asia Conference on Cognitive Engineering and Intelligent Interaction (CEII 2023)
- Date/Location: Held 15-16 December 2023, Hong Kong.
- IEEE #: CFP23UG4-POD
- ISBN: 9798350306972
- Pages: 176 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 Asia Conference on Cognitive Engineering and Intelligent Interaction (CEII 2023)
- Date/Location: Held 15-16 December 2023, Hong Kong.
- IEEE #: CFP23UG4-POD
- ISBN: 9798350306972
- Pages: 176 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )