Details
- Title: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024)
- Date/Location: Held 7-10 April 2024, Catania, Italy.
- IEEE #: CFP24566-POD
- ISBN: 9798350393644
- Pages: 765 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2024 )
Description
Members/Attendees
Tab 4
- Title: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024)
- Date/Location: Held 7-10 April 2024, Catania, Italy.
- IEEE #: CFP24566-POD
- ISBN: 9798350393644
- Pages: 765 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2024 )