Details
- Title: 2023 24th International Conference on Electronic Packaging Technology (ICEPT 2023)
- Date/Location: Held 8-11 August 2023, Shihezi City, China.
- IEEE #: CFP23553-POD
- ISBN: 9798350338829
- Pages: 2,355 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 24th International Conference on Electronic Packaging Technology (ICEPT 2023)
- Date/Location: Held 8-11 August 2023, Shihezi City, China.
- IEEE #: CFP23553-POD
- ISBN: 9798350338829
- Pages: 2,355 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Sep 2024 )