Details
- Title: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2023)
- Date/Location: Held 12-14 December 2023, Rose-Hill, Mauritius.
- IEEE #: CFP23EDP-POD
- ISBN: 9798350383775
- Pages: 114 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2023)
- Date/Location: Held 12-14 December 2023, Rose-Hill, Mauritius.
- IEEE #: CFP23EDP-POD
- ISBN: 9798350383775
- Pages: 114 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )