Details
- Title: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME 2023)
- Date/Location: Held 18-20 October 2023, Craiova, Romania.
- IEEE #: CFP2307I-POD
- ISBN: 9798350344127
- Pages: 368 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME 2023)
- Date/Location: Held 18-20 October 2023, Craiova, Romania.
- IEEE #: CFP2307I-POD
- ISBN: 9798350344127
- Pages: 368 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )