Details
- Title: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC 2023)
- Date/Location: Held 11-14 September 2023, Cambridge, United Kingdom.
- IEEE #: CFP2354H-POD
- ISBN: 9781665487368
- Pages: 423 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC 2023)
- Date/Location: Held 11-14 September 2023, Cambridge, United Kingdom.
- IEEE #: CFP2354H-POD
- ISBN: 9781665487368
- Pages: 423 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2024 )