MICROARCHITECTURE. IEEE/ACM INTERNATIONAL SYMPOSIUM. 56TH 2023. (MICRO 2023) (2 VOLS)

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072943
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Details

  • Title: 2023 56th IEEE/ACM International Symposium on Microarchitecture (MICRO 2023)
  • Date/Location: Held 28 October - 1 November 2023, Toronto, Ontario, Canada.
  • IEEE #: CFP23071-POD
  • ISBN: 9798350330564
  • Pages: 1,480 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2024 )

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Tab 4

 
  • Title: 2023 56th IEEE/ACM International Symposium on Microarchitecture (MICRO 2023)
  • Date/Location: Held 28 October - 1 November 2023, Toronto, Ontario, Canada.
  • IEEE #: CFP23071-POD
  • ISBN: 9798350330564
  • Pages: 1,480 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2024 )