Details
- Title: 2023 3rd International Conference on Computer Science and Blockchain (CCSB 2023)
- Date/Location: Held 17-19 November 2023, Shenzhen, China.
- IEEE #: CFP23DR9-POD
- ISBN: 9798350359084
- Pages: 209 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 3rd International Conference on Computer Science and Blockchain (CCSB 2023)
- Date/Location: Held 17-19 November 2023, Shenzhen, China.
- IEEE #: CFP23DR9-POD
- ISBN: 9798350359084
- Pages: 209 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2024 )