Details
- Title: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS 2023)
- Date/Location: Held 6-9 August 2023, Tempe, Arizona, USA.
- IEEE #: CFP23MID-POD
- ISBN: 9798350302110
- Pages: 1,136 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS 2023)
- Date/Location: Held 6-9 August 2023, Tempe, Arizona, USA.
- IEEE #: CFP23MID-POD
- ISBN: 9798350302110
- Pages: 1,136 (2 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2024 )