IMAGE AND SIGNAL PROCESSING, BIOMEDICAL ENGINEERING AND INFORMATICS. INTERNATIONAL CONGRESS. 16TH 2023. (CISP-BMEI 2023) (2 VOLS)

IMAGE AND SIGNAL PROCESSING, BIOMEDICAL ENGINEERING AND INFORMATICS. INTERNATIONAL CONGRESS. 16TH 2023. (CISP-BMEI 2023) (2 VOLS)

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072385
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Details

  • Title: 2023 16th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2023)
  • Date/Location: Held 28-30 October 2023, Taizhou, China.
  • IEEE #: CFP23J14-POD
  • ISBN: 9798350330762
  • Pages: 1,013 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2024 )

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  • Title: 2023 16th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI 2023)
  • Date/Location: Held 28-30 October 2023, Taizhou, China.
  • IEEE #: CFP23J14-POD
  • ISBN: 9798350330762
  • Pages: 1,013 (2 Vols)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( May 2024 )