Details
- Title: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2023)
- Date/Location: Held 25-27 October 2023, Taipei, Taiwan.
- IEEE #: CFP2359B-POD
- ISBN: 9798350384130
- Pages: 336 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2023)
- Date/Location: Held 25-27 October 2023, Taipei, Taiwan.
- IEEE #: CFP2359B-POD
- ISBN: 9798350384130
- Pages: 336 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )