MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE. INTERNATIONAL. 18TH 2023. (IMPACT 2023)

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072161
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Details

  • Title: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2023)
  • Date/Location: Held 25-27 October 2023, Taipei, Taiwan.
  • IEEE #: CFP2359B-POD
  • ISBN: 9798350384130
  • Pages: 336 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2024 )

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  • Title: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2023)
  • Date/Location: Held 25-27 October 2023, Taipei, Taiwan.
  • IEEE #: CFP2359B-POD
  • ISBN: 9798350384130
  • Pages: 336 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Feb 2024 )