Details
- Title: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2023)
- Date/Location: Held 27-29 September 2023, Budapest, Hungary.
- IEEE #: CFP23TII-POD
- ISBN: 9798350318630
- Pages: 319 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2023)
- Date/Location: Held 27-29 September 2023, Budapest, Hungary.
- IEEE #: CFP23TII-POD
- ISBN: 9798350318630
- Pages: 319 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )